features aec-q200 quali ed esd protection to iec 61000-4-2 level 4 <1 ns response time to esd strike low leakage current extremely low capacitance (0.05 pf typ.) bidirectional device multi-strike capability applications camera links sensors touchscreen interfaces gps antennas usb 3.0 high-speed communications buses chipguard ? automotive mlc series - esd protectors *rohs directive 2002/95/ec jan. 27, 2003 including annex and rohs recast 2011/65/eu june 8, 2011. speci cations are subject to change without notice. the device characteristics and parameters in this data sheet can and do vary in different applications and actual device perfor mance may vary over time. users should verify actual device performance in their speci c applications. general information electrical characteristics @ 25 ? (unless otherwise noted) parameter symbol cga0402mlc- cga0603mlc- unit 05e 12e 24e 05e 12e 24e dc working voltage v w (dc) 5 12 24 5 12 24 v maximum leakage current @ max. v w (dc) i l <0.01 a typical clamping voltage (note 1) v c 30 v typical trigger voltage (note 1) v t 300 v typical peak voltage (note 2) v p 300 v typical capacitance @ 1 mhz, 1 vrms c o 0.2 0.2 0.2 0.05 pf response time r t <1 ns esd protection: per iec 61000-4-2 level 4 min. contact discharge min. air discharge typical esd withstand 8 15 (note 3) 1000 kv kv pulses operating temperature t opr -55 to +125 ?c storage temperature t stg -55 to +125 ?c bourns ? chipguard ? automotive mlc series is a sub-1 pf protector designed speci? cally for use in automotive circuits requiring esd protection. the cga-mlc series is available in industry standard 0402 and 0603 packages. in addition to its very low capacitance, these protectors exhibit extremely fast response times to esd events making them ideal for protecting a wide array of high speed digitial electronic applications. the chipguard ? automotive mlc series is fully aec-q200 quali? ed and supported. notes: 1. v t and v c measured using tlp (transmission line pulse) method. 2. peak voltage measured under esd test conditions: iec61000-4-2, 8 kv contact discharge. 3. iec 61000-4-2 esd performance for cga0603mlc-05e and cga0603mlc-12e devices will meet minimum 100 reps. some shifting in characteristics may occur when tested over several hundred esd pulses. all other part numbers listed will meet iec 61000-4-2 esd performance with minimum 1000 reps without degradation in performance. *rohs compliant & aec approved asia-paci c: tel: +886-2 2562-4117 ? fax: +886-2 2562-4116 emea: tel: +36 88 520 390 ?fax: +36 88 520 211 the americas: tel: +1-951 781-5500 ? fax: +1-951 781-5700 www.bourns.com
chipguard ? automotive mlc series - esd protectors product dimensions cga0402mlc cga0603mlc dim. series series l 1.00 ?0.10 1.60 ?0.10 (0.04 ?0.004) (0.064 ?0.004) w 0.50 ?0.10 0.85 ?0.15 (0.02 ?0.004) (0.033 ?0.006) h 0.34 ?0.10 0.51 ?0.05 (0.014 ?0.004) (0.020 ?0.002) b 0.20 ?0.15 0.30 ?0.20 (0.008 ?0.006) (0.012 ?0.008) dimensions: mm (inches) recommended pad layout solder re ow recommendations 110 sec. (min.) 300 250 200 150 100 50 0 30-70 sec. temperature ( c) 120 sec. (min.) preheat stages 1-3 soldering cooling time (seconds) ? this product can be damaged by rapid heating, cooling or localized heating. ? heat shocks should be avoided. preheating and gradual cooling recommended. ? excessive solder can damage the device. print solder thickness of 150 to 200 um recommended. ? solder gun tip temperature should be kept below 280 ? and should not touch the device directly. contact should be less than 3 seconds. a solder gun under 30 watts is recommended. a stage 1 preheat ambient to preheating 30 s to 60 s temperature b stage 2 preheat 140 ? to 160 ? 60 s to 120 s c stage 3 preheat preheat to 200 ? 20 s to 40 s d main heating 200 ? 60 s to 70 s 210 ? 55 s to 65 s 220 ? 50 s to 60 s 230 ? 40 s to 50 s 240 ? 30 s to 40 s 250 ? to 255 ? 5 s e cooling 200 ? to 100 ? 1 ?/s to 4 ?/s cga0402mlc cga0603mlc dim. series series a 0.50 ?0.1 0.75 ?0.1 (0.02 ?0.004) (0.03 ?0.004) b 0.50 ?0.1 0.75 ?0.1 (0.02 ?0.004) (0.03 ?0.004) c 0.50 ?0.1 0.75 ?0.1 (0.02 ?0.004) (0.03 ?0.004) speci cations are subject to change without notice. the device characteristics and parameters in this data sheet can and do vary in different applications and actual device perfor mance may vary over time. users should verify actual device performance in their speci c applications. l h w b h a c b
2.0 ?0.5 (0.08 ?0.02) 178 ?2.0 (7.08 ?0.08) 9.0 ?0.5 (0.36 ?0.02) 13.0 ?1.0 (0.52 ?0.04) 13.0 ?0.5 (0.52 ?0.02) 62.0 ?1.5 (2.48 ?0.06) 21.0 ?0.8 (0.84 ?0.032) chipguard ? automotive mlc series - esd protectors packaging dimensions dimensions: mm (inches) how to order cg a 0n0n mlc - nn x chipguard product designator automotive series package option 0402 = 0402 package 0603 = 0603 package multilayer series designator maximum dc working voltage 05 = 5 v 12 = 12 v 24 = 24 v tape & reel packaging e = 5,000 pcs. per reel (0603 package) g = 10,000 pcs. per reel (0402 package) rev. a 12/13 speci cations are subject to change without notice. the device characteristics and parameters in this data sheet can and do vary in different applications and actual device perfor mance may vary over time. users should verify actual device performance in their speci c applications. top tape notes: tape material is paper. cover tape adhesion is 35 25 grams. tape thickness is: cga0402mlc d w 0.48 0.03 (0.019 0.0012) 0.6 0.03 (0.024 0.0012) c a b f e l cga0603mlc cga0402mlc cga0603mlc dimension series series a 8.00 ?0.30 8.00 ?0.30 (0.315 ?0.012) (0.315 ?0.012) b 3.50 ?0.05 3.50 ?0.05 (0.138 ?0.002) (0.138 ?0.002) c 1.75 ?0.10 1.75 ?0.10 (0.069 ?0.004) (0.069 ?0.004) d 2.00 ?0.05 2.00 ?0.05 (0.079 ?0.002) (0.079 ?0.002) e 4.00 ?0.10 4.00 ?0.10 (0.157 ?0.004) (0.157 ?0.004) f 1.50 ?0.10 1.50 ?0.10 (0.059 ?0.004) (0.059 ?0.004) l 1.19 ?0.05 2.02 ?0.20 (0.047 ?0.002) (0.080 ?0.008) w 0.69 ?0.05 1.27 ?0.15 (0.027 ?0.002) (0.050 ?0.006) t 0.48 ?0.03 0.60 ?0.03 (0.019 ?0.0012) (0.024 ?0.0012)
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